Jonas Gleichauf

Background

Jonas Gleichauf is currently working as a research engineer at the Corporate Sector Research and Advance Engineering of Robert Bosch GmbH. In 2016 he received his B.Sc. in mechanical engineering from the Karlsruher Institute of Technology (KIT). Three years later he obtained his Master degree in aerospace engineering from Stuttgart University. He joined Bosch at the beginning of 2019 for his master thesis where he focussed on the numerical estimation of PCB base materials’ deformation behavior.  For the last three years, he took part in the doctoral program of Bosch where he investigated the reliability of solder joints under combined thermal and bending loads in order to predict the failure probability of soldered components under complex loading scenarios using finite-element simulation methods. His research field now focuses on the virtual qualification of automotive power electronics in order to reduce the time-consuming and cost-intensive testing effort of control units during release processes.

Selected Publications

• J. Gleichauf, Y. Maniar, R. Ratchev, S. Spring and S. Wiese, “Optimization of thermal load distribution in accelerated temperature cycling tests for solder joint lifetime qualification tests,” 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020, pp. 1-6, doi: 10.1109/EuroSimE48426.2020.9152198.
• J. Gleichauf, Y. Maniar and S. Wiese, “Test Screening of Solder Joints Under Combined Cyclic Thermal and Bending Load for Automotive Applications,” 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021, pp. 1-7, doi: 10.1109/EuroSimE52062.2021.9410829.
• J. Gleichauf, Y. Maniar, M. Kuczynska, R. Metasch, M. Roellig and S. Wiese, “Finite-Element Modeling of the Visco-Plastic Shear-Dominant Deformation Behavior of a Creep-Resistant Sn-Based Solder Alloy under TMF Testing,” 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022, pp. 1-8, doi: 10.1109/EuroSimE54907.2022.9758920.
• R. Metasch, M. Roellig, R. Schwerz, J. Gleichauf, Y. Maniar, R. Ratchev and K. Meier, “Optimized TMF Measurement Setup for Reproducible Lifetime Measurements on Solder Joints Under Accelerated Thermal-Mechanical Conditions,” 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022, pp. 1-6, doi: 10.1109/EuroSimE54907.2022.9758911.
• J. Gleichauf, Y. Maniar and S. Wiese, “Reliability testing of solder joints under combined cyclic thermal and bending load for Automotive Applications,” Mircoelectronics Reliability Journal, 2022, doi: 10.1016/j.microrel.2022.114751.