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Consortium

Our unique industry-academia partnership of 8 industries, 4 SMEs and 9 research organisations and academic institutions from 7 European countries has all the expertise, experience and capacity along the electronics system value chain to deliver this ambitious research and training programme.

Beneficiaries

Polymer Competence Center Leoben (PCCL)

Simulation and Modeling / Surface Testing, Robot Vision and Artificial Intelligence

Politecnico di Milano (POLIMI)

Civil and Environmental Engineering

Technische Universität Chemnitz (TU Chemnitz)

Materials and Reliability of

Delft University of Technology (TU Delft)

Electronic Components, Technology and Materials (ECTM)

VZW Interuniversitair Micro-Electronica Centrum (IMEC)

Solutions/EA, SEA-ESTSAT-MMICRO UOG

ams AG (ams OSRAM)

AOS Packaging Materials and Simulation

AT & S Austria Technologie & Systemtechnik AG

R&D Center Service

Robert Bosch GmbH (Bosch)

Technology, Packaging & Reliability

Berliner Nanotest und Design GmbH (Nanotest)

Materials and Reliability of Microsystems

Nexperia BV (Nexperia)

Package R&D – Research

NXP Semiconductors N.V. (NXP)

Corporate Quality, NTI/NPI & Reliability

Siemens Industry Software NV (SISW)

3D Simulation

Technoprobe S.p.A. (Technoprobe)

R&D; Probe Head Technology and Materials; Artificial Intelligence & RPA

Associated partners

University of Greenwich (UOG)

Materials Consultancy Services Ltd. (MCS)

accelopment Schweiz AG (accelCH)

Katholieke Universiteit Leuven (KU Leuven)

Montanuniversität Leoben (MUL)

Signify N.V. (signify)

Material Center Leoben (MCL)

Funded by the European Union (Grant Agreement No. 101072491). Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the European Research Executive Agency. Neither the European Union nor the granting authority can be held responsible for them. Partners from the UK are supported by the UK Engineering and Physical Sciences Research Council.
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