Publications, Pre-prints, Conference Proceedings, and Datasets
Kamble, V. G., Patel, D. R., Schipfer, C., Thalhamer, A., Zuendel, J., Krivec, T., Antretter, T., & Fuchs, P. (2024). A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies. IEEEXplore. 10.1109/EuroSimE60745.2024.10491487
Mohamed, D. May, D. Pareek, K. A. Ras, M. A. & Wunderle, B. (2024). Enhancing Defect Detection Using Lock In Thermography. IEEEXplore. 10.1109/EuroSimE60745.2024.10491470
Muhammad, M. Inamdar, A. & Roucou, R. (2024). Investigating Competing Failure Modes in Microelectronic Devices Due to Small Temperature Variations. IEEEXplore. 10.1109/ESTC60143.2024.10712024
Porathur, F. J., KAMBLE, V. G., Stadler, E., Huber, F., Fuchs, P. F. & Gruber, D. P. (2024). Warpage Optimisation of Package Substrates Using Metamodels – A Review. IEEEXplore. 10.1109/EuroSimE60745.2024.10491528
Yu, Q., Kamble, V. G., Gruber, D. P., Fuchs, P., Fendt, K., & Krivec, T. (2024). Literature Review: Global Criticality Assessment Based on Feature Surrogates at the PCBA Levels. IEEEXplore. 10.1109/EuroSimE60745.2024.10491544
