MIRELAI Results – MIRELAI

Results

Publications, Pre-prints, Conference Proceedings, and Datasets

2026

Topology-optimised near-chip microfluidic cooling for high power electronics

Zihan Zhang, Henry A. Martin, Edsger C. P. Smits, René Poelma, Jiajie Fan, Willem van Driel, GuoQi Zhang

Published in: Case Studies in Thermal Engineering, 85, 108358

Publisher: Elsevier

DOI: 10.1016/j.csite.2026.108358

Co-packaged electronics with microfluidics for direct-to-package cooling

Henry A. Martin, Zihan Zhang, Mahad Saheed, Sander Dorrestein, Edsger C. P. Smits, René Poelma, Willem van Driel, GuoQi Zhang

Published in: Communications Engineering, 5, 92, 2026

Publisher: Springer Nature

DOI: 10.1038/s44172-026-00620-9

Multi-Objective 3D Topology Optimisation for Heat Sinks with Multiple Heat Sources

Zihan Zhang, Henry Martin, Willem van Driel, René Poelma, GuoQi Zhang

Published in: 2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Dallas, TX, USA, 2025

Publisher: IEEE Xplore

DOI: 10.1109/ITherm55376.2025.11235731

Machine Learning for Microstructure Characterisation of Intermetallic Layers in BGA Solder Joints

Muhammad Umair Najeem, Razia Sultana Abdul Kareem, Aidan M. Robinson, Patricia Ferrie, Stewart McCracken, Stoyan Stoyanov

Published in: 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Warsaw, Poland, 2026

Publisher: IEEE Xplore

DOI: 10.1109/EuroSimE69483.2026.11511976

Failure Analysis of Electronic Packaging using Eddy Current Thermography

Yanan Wu, Daniel May, Mohamad Abo Ras, Bernhard Wunderle

Published in: 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Warsaw, Poland, 2026

Publisher: IEEE Xplore

DOI: 10.1109/EuroSimE69483.2026.11511894

AVA-Based Surrogate Modeling of Localized Strain in Microvia

Qiulin Yu, Thomas Krivec, Jan Albrecht, Horn Tobias, Karl Fendt, Dieter P. Gruber

Published in: 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Warsaw, Poland, 2026

Publisher: IEEE Xplore

DOI: 10.1109/EuroSimE69483.2026.11511987

Efficient Augmented Kalman Filter Parameter Tuning for Thermal Virtual Sensing in Electronic Systems

Matteo Depaola, Daniel De Gregoriis, Robin Bornoff, Bart Vandevelde, David Moens

Published in: 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Warsaw, Poland, 2026

Publisher: IEEE

DOI: 10.1109/EuroSimE69483.2026.11511902

Transformer-based SHM of Semiconductor Probe Cards: Unifying Optimal Sensor Placement and Missing-Data Imputation for Reliable Online Monitoring

Mehdi Bejani, Marco Mauri, Stefano Mariani

Published in: 2026 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Warsaw, Poland, 2026

Publisher: IEEE Xplore

DOI: 10.1109/EuroSimE69483.2026.11511915

AI-Assisted Framework for Real-Time Monitoring and Management of Probe Cards in Electrical Wafer Sort Applications

Author(s): Mehdi Bejani, Davide Appello, Marco Mauri, Simone Todaro, Stefano Mariani

Published in: 2025 IEEE European Test Symposium (ETS), Tallinn, Estonia, 2025

Publisher: IEEE Xplore

DOI: 10.1109/ETS63895.2025.11049606

Digital Twin-Assisted Optimal Sensor Placement for Real-Time Monitoring of Probe Cards in EWS Applications

Author(s): Mehdi Bejani, Davide Appello, Marco Mauri, Elia Missaglia, Stefano Mariani

Published in: 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Utrecht, Netherlands, 2025

Publisher: IEEE Xplore

DOI: 10.1109/EuroSimE65125.2025.11006625

2025

Modelling the Impact of Crystal Orientation on Mechanical Damage of SAC305

Muhammad Umair Najeem, Razia Sultana Abdul Kareem, Stoyan Stoyanov

Published in: 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Utrecht, Netherlands, 2025

Publisher: IEEE Xplore

DOI: 10.1109/EuroSimE65125.2025.11006576

Heat Sink Effects in Power Module Design: Multiphysics Simulation with Multiple Heat Sources

Zihan Zhang, Qiulin Yu, Bart Vandevelde, Willem van Driel, René Poelma

Published in: 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Utrecht, Netherlands, 2025

Publisher: IEEE Xplore

DOI: 10.1109/EuroSimE65125.2025.11006540

Application of machine learning modeling for predicting the reliability of solder joints under thermal cycling

Qiulin Yu

Published in: Microelectronics Reliability, 174, 115900, 2025

Publisher: Elsevier

DOI: 10.1016/j.microrel.2025.115900

Physics-informed Machine Learning-based Methodology for Plated Through Holes Lifetime Estimation in Printed Circuit Boards

Marco Sperti

Published in: EuroSimE 2025, Utrecht, the Netherlands, 2025

Publisher: IEEE

DOI: 10.1109/EUROSIME65125.2025.11006582

Failure Analysis for Electronic Packaging Materials: A Comparative Study of Pulsed Thermography and Lock-in Thermography

Yanan Wu, Kaushal Arun Pareek, Daniel May, Marek Zajaczkowski, Corinna Grosse-Kockert, Mohamad Abo Ras, Ralpf Schacht, Bernhard Wunderle

Published in: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2025

Publisher: IEEE

DOI: 10.1109/therminic65879.2025.11216883

Optimal Sensor Placement for Thermal Virtual Sensing in electronic systems using Augmented Kalman Filtering (

Matteo Depaola, Daniel De Gregoriis, Robin Bornoff, Bart Vandevelde, David Moens

Published in: International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Naples, Italy, 2025, ISSN 2474-1523

Publisher: IEEE

DOI: 10.1109/THERMINIC65879.2025.11216915

2024

Investigating Competing Failure Modes in Microelectronic Devices Due to Small Temperature Variations

Muhammad Musadiq, Adwait Inamdar, Romuald Roucou

Published in: IEEE ESTC, Berlin, Germany, 2024, ISSN 2687-9727

Publisher: IEEE

DOI: 10.1109/ESTC60143.2024.10712024

Thermal virtual sensing for electronic components and systems: exploring the robustness of Kalman filtering

Matteo Depaola, Daniel De Gregoriis, Gwendal Jouan, Robin Bornoff, Onur Atak, Bart Vandevelde, David Moens

Published in: Proceedings of ISMA/USD 2024, International Conference on Uncertainty in Structural Dynamics (USD2024), Leuven, Belgium, 2024

Publisher: KU Leuven

DOI: 10.5281/zenodo.16636877

Literature Review: Global Criticality Assessment Based on Feature Surrogates at the PCBA Levels

Qiulin Yu, Vikram G. Kamble, Dieter P. Gruber, Peter F. Fuchs, Karl Fendt, Thomas Krivec

Publisher: IEEE

DOI: 10.1109/EuroSimE60745.2024.10491544

Warpage Optimization of Package Substrates Using Metamodels - A Review

Fredy John Porathur, Vikram G. Kamble, Eduard Stadler, Fabian Huber, Peter Filipp Fuchs, Dieter P. Gruber

Published in: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Catania, Italy, 2024, ISSN 2833-8596

Publisher: IEEE

DOI: 10.1109/EuroSimE60745.2024.10491528

A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

Vikram G. Kamble, Dhaval Rasheshkumar Patel, Christian Schipfer, Andreas Thalhamer, Julia Zuendel, Thomas Krivec, Thomas Antretter, Peter Filipp Fuchs

Published in: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Catania, Italy, 2024, ISSN 2833-8596

Publisher: IEEE

DOI: 10.1109/EuroSimE60745.2024.10491487

Enhancing Defect Detection Using Lock In Thermography

Doaa Mohamed, Daniel May, Kaushal Arun Pareek, Mohamad Abo Ras, Bernhard Wunderle

Publisher: IEEE

DOI: 10.1109/EuroSimE60745.2024.10491470