Dr. ir. René Poelma


Dr. René Poelma is a Senior Principal Engineer in package research at Nexperia Nijmegen. He holds a PhD degree (cum laude) in Microelectronics from Delft University of Technology and is the Chair of the IEEE Electronic Packaging Society (EPS) Benelux Chapter. He has a solid track record with high impact scientific publications and patents (~50), and grant applications for several public funded European and national research projects. With over 10 years of experience (4 years PhD, 2 years post-Doc and 4 years at Nexperia) in electronics packaging and semiconductor R&D. He has a large international network and solid knowledge of simulation, characterization, design and analysis for semiconductor packaging and processes. His research interests include semiconductor packaging, material science, process technologies, MEMs, and developing new FEA tools for analysing complex material behavior.

Selected Publications
  • Yi, H., E. Ozturk, M. Koelink, J. Krimmling, A.A. Damian, W. Debski, H. van Zeijl, G. Zhang, and R.H. Poelma, Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2022. 12(6): p. 893-901.
  • Nyns, E.C., R.H. Poelma, L. Volkers, J.J. Plomp, C.I. Bart, A.M. Kip, T.J. Van Brakel, K. Zeppenfeld, M.J. Schalij, and G.Q. Zhang, An automated hybrid bioelectronic system for autogenous restoration of sinus rhythm in atrial fibrillation. Science translational medicine, 2019. 11(481): p. eaau6447.
  • El Mansouri, B., L.M. Middelburg, R.H. Poelma, G.Q. Zhang, H.W. van Zeijl, J. Wei, H. Jiang, J.G. Vogel, and W.D. van Driel, High-resolution MEMS inertial sensor combining large displacement buckling behaviour with integrated capacitive readout. Microsystems & nanoengineering, 2019. 5(1): p. 1-14.
  • Silvestri, C., M. Riccio, R.H. Poelma, A. Jovic, B. Morana, S. Vollebregt, A. Irace, G.Q. Zhang, and P.M. Sarro, Effects of Conformal nanoscale coatings on thermal performance of vertically aligned carbon nanotubes. Small, 2018. 14(20): p. 1800614.
  • Middelburg, L., B. El Mansouri, R. Poelma, G. Zhang, H. Van Zeijl, and J. Wei. Non-linear bulk micromachined accelerometer for high sensitivity applications. in 2018 IEEE SENSORS. 2018. IEEE.
  • Huang, Z., R.H. Poelma, S. Vollebregt, M. Koelink, E. Boschman, R. Kropf, M. Gallouch, and G. Zhang. Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing. in 2018 7th Electronic System-Integration Technology Conference (ESTC). 2018. IEEE.
  • van Driel, W., B. Jacobs, D. Schenkelaars, M. Klompenhouwer, R. Poelma, B. El Mansouri, and L. Middelburg. Prognostics & health management for LED-based applications. in 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). 2017. IEEE.
  • Zhang, B., Y. Carisey, A. Damian, R.H. Poelma, G.Q. Zhang, and H. van Zeijl. 3D Interconnect technology based on low temperature copper nanoparticle sintering. in 2016 17th International Conference on Electronic Packaging Technology (ICEPT). 2016. IEEE.
  • Silvestri, C., M. Riccio, R.H. Poelma, B. Morana, S. Vollebregt, F. Santagata, A. Irace, G.Q. Zhang, and P.M. Sarro, Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis. Nanoscale, 2016. 8(15): p. 8266-8275.
  • Poelma, R.H., X. Fan, Z.Y. Hu, G. Van Tendeloo, H.W. van Zeijl, and G.Q. Zhang, Effects of nanostructure and coating on the mechanics of carbon nanotube arrays. Advanced Functional Materials, 2016. 26(8): p. 1233-1242.
  • Li, X., L. Wei, R.H. Poelma, S. Vollebregt, J. Wei, H.P. Urbach, P.M. Sarro, and G.Q. Zhang, Stretchable binary Fresnel lens for focus tuning. Scientific Reports, 2016. 6(1): p. 1-8.
  • Poelma, R.H., B. Morana, S. Vollebregt, E. Schlangen, H.W. van Zeijl, X. Fan, and G.Q. Zhang, Tailoring the mechanical properties of high‐aspect‐ratio carbon nanotube arrays using amorphous silicon carbide coatings. Advanced Functional Materials, 2014. 24(36): p. 5737-5744.
  • Santagata, F., I. Zaccaria, R. Poelma, J. Creemer, G. Zhang, and P. Sarro. A new self-sealing thin-film encapsulation process for MEMS. in 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII). 2013. IEEE.
  • Morana, B., R.H. Poelma, G. Fiorentino, J. Wei, J.F. Creemer, and P.M. Sarro, Stiction-induced sealing of surface micromachined channels. Journal of microelectromechanical systems, 2013. 23(2): p. 459-470.
  • Wong, C.K., S.Y. Leung, R.H. Poelma, K.M. Jansen, C.C. Yuan, W.D. van Driel, and G. Zhang, Establishment of the coarse grained parameters for epoxy-copper interfacial separation. Journal of Applied Physics, 2012. 111(9): p. 094906.
  • Poelma, R., H. Sadeghian, S. Noijen, J. Zaal, and G. Zhang, A numerical experimental approach for characterizing the elastic properties of thin films: application of nanocantilevers. Journal of Micromechanics and Microengineering, 2011. 21(6): p. 065003.

Dr. ir. René Poelma


Supervisor of DC4