Dr. Bart Vandevelde

Background

Dr. Bart Vandevelde has a master and PhD degree in mechanical engineering from the KULeuven. He has done research for more than 25 years in several reliability research groups within IMEC, covering from back-end IC to system level. Currently, he is an R&D project leader within the Solutions department. He is a co-founder and member of the organisation committee for the EUROSIME conference. His research interest is in advanced electronic packaging, thermo-mechanical reliability, experiments and FEM simulations and AI/ML techniques for health monitoring of electronic systems.

Selected Publications

• Riet Labie; Bart Vandevelde; Wesley van Meensel; Mike Vogeleer; Daniel Werkhoven; Bart Allaert; Geert Willems “In-situ monitoring of field conditions and interconnect integrity for an electronic on-board module,” 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017, pp. 1-5
• P. Ferrando-Villalba and B. Vandevelde, “BGA solder strain prediction using an Artificial Neural Network regressor,” 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2022, pp. 1-7
• B. Vandevelde et al., “Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q,” 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2019, pp. 1-5