Dr. René Rongen
Corporate Quality, NTI/NPI & Reliability
René Rongen is currently a Fellow in Applied Reliability. He received his Master and his PhD degree in Physics at respectively the Rheinisch Westfälische Technische Hochschule Aachen and the Technical University Eindhoven. He is the author/co-author of articles and international conference papers as well as co-author of a book chapter; he is a committee member/session chair at ECTC and ESREF.
doi.org/10.1109/ESTC.2018.8547202; ESTC conference; Effect of PCB stack-up on Temperature Cycling Reliability of WLCSP; R. Roucou, R.T.H. Rongen, J.J.M. Zaal, P.J. van der Wel
doi.org/10.1016/j.microrel.2014.07.112; Microelectronics Reliability; Comparison of in-situ measurement techniques of solder joint reliability under thermo-mechanical stresses; N. Duan, T. Bach, J. Shen, R. Rongen
doi.org/10.1016/j.microrel.2014.07.012; Microelectronics Reliability; Reliability of Wafer Level Chip Scale Packages; R.T.H. Rongen, Romuald Roucou, P.J. van der Wel, F.C. Voogt, F. Swartjes, K. Weide-Zaage
doi.org/10.1007/978-3-030-81576-9_12; Chapter Reliability and Failure of Microelectronic Materials in Reliability of Organic Compounds in Microelectronics and Optoelectronics, From Physics-of-Failure to Physics-of-Degradation; Amar Mavinkurve, R.T.H Rongen, M. van Soesbergen