Dr. Romuald Roucou
Corporate Quality, NTI/NPI & Reliability
Romuald Roucou is currently the Senior Principal Engineer. He received his Engineer and Master degrees resp. at Ecole Européene de Chimie, Polymères et Matériaux, Strasbourg, France and Université de Strasbourg, France and his PhD degree at Ecole des Mines de Saint-Etienne, France. He is the author/co-author of 4 peer-reviewed publications and 13 international conference papers.
- doi.org/10.1016/j.microrel.2021.114096; Microelectronics Reliability; Semi-empirical law for fatigue resistance of redistribution layers in chip-scale packages; M. van Soestbergen, Q. Jiang, J.J.M. Zaal, R. Roucou, A. Dasgupta
- doi.org/10.1109/ESTC.2018.8547202; ESTC conference; Effect of PCB stack-up on Temperature Cycling Reliability of WLCSP; R. Roucou, R.T.H. Rongen, J.J.M. Zaal, P.J. van der Wel
- doi.org/10.1016/j.microrel.2014.07.012; Microelectronics Reliability; Reliability of Wafer Level Chip Scale Packages; R.T.H. Rongen, Romuald Roucou, P.J. van der Wel, F.C. Voogt, F. Swartjes, K. Weide-Zaage