Thomas Krivec

Background

After receiving his Degree as a Diplomingenieur (Master Degree) in plastics engineering from the Montan-University Leoben in Austria, Thomas worked for more than a decade in product and process development for plastic based components and solutions in several industrial areas such as aerospace, automotive and construction. Since joining AT&S in 2011 he has been responsible for the development and implementation of the product and reliability simulation process at AT&S. Thomas is currently program manager in the group R&D of AT&S with the responsibility for the Virtual Development & Resource Efficiency Team as well as the global AT&S Simulation Service Center at Leoben Hinterberg. The current research focus of Thomas has been put on the optimization of the AT&S simulation toolset (FEA based) including a comprehensive material data base, on databased modelling of manufacturing processes and on developments improving the environmental footprint of PCB manufacturing.

Selected Publications

• Finite element analysis of arbitrarily complex electronic devices, Mario Gschwandl; Peter Fuchs; Klaus Fellner; Thomas Antretter; Thomas Krivec; Tao Qi 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), Year: 2016,  Conference Paper

• Comparison of Finite Elements Based Thermal Shock Test Reliability Assessment With a Specimen Based Test Approach, Qi Tao, Thomas Krivec, Manfred Riedler, Markus Frewein, IPC APEX 2018, 2018, Conference Paper

• Package Level Warpage Simulation of a Fan Out System in Board Module, M. Frewein; T. Krivec; Q. Tao; J. Zuendel; J. Rosc; M. Gschwandl; Peter F. Fuchs, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2019, Conference Paper

• Panel Level Warpage Simulation of Printed Circuit Boards comprising electrical components, J. Zündel; T. Krivec; Q. Tao; M. Frewein; S. Stojanovic, 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2020, Conference Paper

• Characterization of prepreg shrinkage and investigation of its influence on warpage simulation, J. Zündel; M. Sagerer; M. Frewein; T. Krivec, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2021 | Conference Paper

• An advanced, systematic simulation approach for studying warpage drivers of an assembled printed circuit board in early development stage, M. Frewein; S. Stojanovic; Q. Tao; T. Krivec; J. Zuendel; M. Goessler; P. F. Fuchs; M. Gschwandl
  2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
  2022 | Conference Paper