The EuroSimE 2023, the 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, was held from April 16th to April 19th, 2023 in the city of Graz, Austria.
The conference programme was scheduled from Monday to Wednesday and included a wide range of presentations in the fields of microelectronics and microsystems, featuring 165 professionals from 19 countries. Each presentation was followed by engaging and productive discussions with the conference participants.
The EuroSimE conference was locally organised by Dr. Peter Fuchs, MIRELAI project coordinator, and Head of Research Group Simulation Strategies at Polymer and Polymer Composite Designs. In the opening keynote, Dr Fuchs provided an overview of the MIREALI network and its goal of training the next generation of engineers for reliable microelectronics.
EuroSimE is an established international and IEEE listed conference with worldwide recognition, attended by leading experts of both the industry and academia.
Additionally, it provides a collaborative and networking platform for dedicated sessions on funded projects and roadmaps for future microelectronic products (e.g. Heterogenous Integration Roadmap).
One interesting aspect of EuroSimE 2023 was the fact that the best papers were selected and submitted for publishing in two Elsevier Journals, namely the Microelectronics Reliability and Mechatronics journals, as well as one open access journal: MDPI Micromachines.
Overall, EuroSimE 2023 provided an excellent opportunity to hear from prominent speakers, engage in stimulating discussions, and network with professionals who share similar interests. Furthermore, this event presented a great chance for the MIRELAI network to expand its outreach efforts and connect with like-minded individuals.
