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MIRELAI Final Event held as a Special Session at EuroSimE 2026

The MIRELAI Final Event took place during EuroSimE 2026, held from 19 to 22 April 2026 in Warsaw, Poland. The event was organised as a dedicated MIRELAI Special Session within the international conference programme, providing a platform to present key scientific results from the Doctoral Network to the wider microelectronics reliability community.

The session, S16 – MIRELAI Session, took place on Wednesday, 22 April 2026, and was chaired by Dr Bart Vandevelde, IMEC. The organisation of the session was led by Matteo Depaola (DC7) and Marco Sperti (DC8), with support from PCCL, IMEC and TU Delft.

The Special Session included five presentations by MIRELAI Doctoral Candidates and collaborators, covering reliability modelling, machine learning, thermal sensing, solder joint reliability, plated through holes and semiconductor materials:

  • Muhammad Musadiq (DC6): Influence of Low Temperature Swings on Solder Joint Reliability
  • Muhammad Umair Najeem (DC10): Machine Learning for Microstructure Characterisation of Intermetallic Layers in BGA Solder Joints
  • Matteo Depaola (DC7): Efficient Augmented Kalman Filter Parameter Tuning for Thermal Virtual Sensing in Electronic Systems
  • Marco Sperti (DC8): Effect of Electroplating-induced Copper Thickness Variations on the Thermomechanical Reliability of Plated Through Holes
  • Shehryar Imtiaz (DC12): Physics-informed Neural Network for Multi-scale Thermal Transport in AlGaN/GaN HEMT Heterostructures

The session supported the project’s dissemination objectives by increasing the visibility of MIRELAI research, enabling scientific exchange with academic and industrial experts, and strengthening the international presentation experience of the Doctoral Candidates. The contributions also reflected the interdisciplinary character of MIRELAI, combining simulation, experimentation, data-driven approaches and reliability assessment for future microelectronic systems.

S16 - MIRELAI special session & final event

Conference papers linked to the MIRELAI contributions are expected to be published in the IEEE conference proceedings, further supporting the long-term dissemination of the project results. Publicly available information and proceedings related to the event can also be found at: