Stay informed about MIRELAI’s upcoming events
The 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems will be held in Warsaw from 19 -22 April 2026.
This year’s edition includes a special session dedicated to MIRELAI on Wednesday 22 April from 8:20 – 9:50 am.
Additionally, following DCs will present results: Matteo Depaola (DC7), Mehdi Bejani (DC13), Muhammad Umair Najeem (DC10), Marco Sperti (DC8).
The SPIE Photonics Europe conference in Strasbourg, France will be held from 12 – 16 April 2026. Mehdi Bejani (DC13) will attend and share results.
The MIRELAI webinar series is designed to encourage collaboration and knowledge exchange among DCs and interested parties. In addition a short presentation by each DC, the fifth webinar featured a guest talk by Davide Appello
(Technoprobe) on “Trends in semiconductor markets and their effects on testing and reliability methods”.
The 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2025) was successfully held in Naples from September 24th to 26th. The event provided an excellent platform for sharing and discussing cutting-edge research in thermal management. Matteo Depaola (DC7) and Yanan Wu (DC11) presented their work.
Interested? Read more here.
The MIRELAI Third Annual Network Meeting welcomes all DCs and project partners. The third and final annual meeting of the MIRELAI consortium took place in Milan from June 30 to July 3. Like the previous two editions, it provided an excellent opportunity for cutting-edge research discussions and team building.
Interested? Read more here.
The MIRELAI webinar series is designed to encourage collaboration and knowledge exchange among DCs and interested parties.
In addition to the usual exchange between DCs, in this edition, Dr. Adwait Inamdar gave an insightful talk on DigitalTwin technology for microelectronics reliability and its applications in the semiconductor industry.
The MIRELAI webinar series is designed to encourage collaboration and knowledge exchange among DCs and interested parties. In addition to the usual exchange between DCs, the webinar featured a guest talk by Fengze Hou (IMECAS) on “Thermal management in advanced electronic packages”.
The MIRELAI webinar series is designed to encourage collaboration and knowledge exchange among DCs and interested parties. The third webinar of the series provided an update on research, a talk on the technical outcomes and advances in microelectronics reliability achieved in the iRel40 Project by Julia Zündel (AT&S) and Klaus Pressel (Infineon), and presentations by DCs on their projects, followed by internal scientific discussions.
DC4, DC5, and DC6 participated in the 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024), a leading international event focused on electronics packaging and system integration. Held every two years in Europe, the conference is supported by IEEE-EPS in collaboration with IMAPS Europe.
Interested? Read more here!
DC7 participated in the 31st International ISMA Conference, which serves as a forum for engineers, researchers, and professionals engaged in modelling, analysing, testing, and enhancing the noise and vibration characteristics of mechanical, mechatronic systems, and civil structures.
Interested? Read more here.
The MIRELAI webinar series is designed to encourage collaboration and knowledge exchange among DCs and interested parties. The second webinar of the series provided an update on research, a talk on heat, stress, and reliability by an external by Prof Daniel Rostisval, and presentations by DCs on their projects, followed by internal scientific discussions.
The MIRELAI Second Annual Network Meeting welcomes all DCs and project partners. This event will provide updates on project status and include training sessions for scientific and industry skills, as well as project management Additionally, it provides an opportunity for its participants to network and team-build through the planned social activities.
Interested? Read more here.
The MIRELAI webinar series is designed to encourage collaboration and knowledge exchange among DCs and interested parties. The first webinar provides an update on research, a talk on challenges of thermal management in microelectronics by an external by Dr Elke Kraker (MCL), and presentations by DCs on their projects, followed by internal scientific discussions.
Interested? Read more here.
EuroSimE is an established international and IEEE-listed conference with worldwide recognition, attended by leading experts of both the industry and academia. It provides a collaborative and networking platform for dedicated sessions on funded projects and roadmaps for future microelectronic products. During the latest edition, several DCs and partners from the MIRELAI project had the opportunity to participate in the 2024 EuroSimE conference.
Participating DCs (DC1, DC2, DC3, DC11) showcased their research progress through insightful poster presentations, sparking meaningful discussions and engaging with a community of experts.
Interested? Read more here.
The MIRELAI Machine Learning Workshop, hosted by Polymer Competence Center Leoben GmbH (PCCL) in Austria, was an immersive two-day event that aimed to redefine the landscape of machine learning. With the participation of esteemed speakers in the field of microelectronics, it offered a deep dive into the latest advancements and applications of machine learning technologies.
Interested? Read more here.
The EuroSimE 2023, the 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, was held from April 16th to April 19th, 2023 in the city of Graz, Austria. In the opening keynote, Dr Fuchs provided an overview of the MIREALI network and its goal of training the next generation of engineers for reliable microelectronics.
Interested? Read more here.
