MIRELAI Doctoral Candidates contributed extensively to the wider EuroSimE 2026 programme in Warsaw, Poland, from 19 to 22 April 2026. In addition to the dedicated MIRELAI Final Event, their participation across oral presentations, poster sessions and paper submissions demonstrated the scientific breadth of the network.
The contributions covered several key research areas in microelectronics reliability, including digital twins, machine learning, structural health monitoring, advanced packaging, thermal analysis, microvias, solder joints and semiconductor devices. By presenting their work to an international audience of academic and industrial experts, the Doctoral Candidates strengthened the visibility of MIRELAI and received valuable feedback for the further development and exploitation of their research results.
The conference provided an important platform for the Doctoral Candidates to exchange with researchers, engineers and industry representatives working on the reliability of future microelectronic systems. Their contributions also showed how MIRELAI combines experimental methods, simulation, machine learning and physics-informed approaches to address reliability challenges across the European microelectronics value chain.
Conference papers linked to the MIRELAI contributions can be found at:
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- Explore MIRELAI events
