MIRELAI held its Final Event as a dedicated Special Session at EuroSimE 2026 in Warsaw, showcasing research results from Doctoral Candidates working on microelectronics reliability, modelling, machine learning and advanced packaging.
MIRELAI held one of its final Management Board meetings to review progress, remaining deliverables, reporting activities and the next steps towards project completion.
During EuroSimE 2026 in Warsaw, the MIRELAI consortium visited the birthplace of Marie Skłodowska-Curie, highlighting the project’s connection to the scientific legacy behind the MSCA programme.
MIRELAI Doctoral Candidates contributed widely to EuroSimE 2026 through presentations, posters and paper submissions, highlighting advances in AI-enabled reliability modelling, structural health monitoring, advanced packaging and thermal analysis.
We are delighted to present the second edition of the MIRELAI Newsletter, continuing our mission to showcase the collaborative achievements, scientific advancements, and innovative spirit driving the MIRELAI network. This edition celebrates the progress made by our doctoral researchers and
The 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2025) was successfully held in Naples from September 24th to 26th. The event provided an excellent platform for sharing and discussing cutting-edge research in thermal management. THERMINIC is
