MIRELAI Doctoral Candidates contributed widely to EuroSimE 2026 through presentations, posters and paper submissions, highlighting advances in AI-enabled reliability modelling, structural health monitoring, advanced packaging and thermal analysis.

We are delighted to present the second edition of the MIRELAI Newsletter, continuing our mission to showcase the collaborative achievements, scientific advancements, and innovative spirit driving the MIRELAI network. This

The 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2025) was successfully held in Naples from September 24th to 26th. The event provided an excellent platform for